Event
Recruiting Event

bonding company contact fair Berlin

26. November 2019 – 26. November 2019 / 09:00 – 16:30
Organizer
Technical University of Berlin
Venue
Technical University of Berlin
Strasse des 17. Juni
10623 Berlin
Germany
Plan route
Date
26. November 2019 – 26. November 2019
09:00 – 16:30
Downloads
Event / iCal

The bonding company contact fair Berlin is the largest event of its kind organized by students in Berlin.